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31	3D IC integration and ESD: “Not the ESD you grew up with!” Stephen Fairbanks Managing Director Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-01-22 10:41:25 Physics Electricity Electrical safety Electrical breakdown Electrostatics Electrostatic discharge Three-dimensional integrated circuit Through-silicon via Wafer backgrinding Electromagnetism Semiconductor device fabrication Integrated circuits
32	3DIC in Production, Making Chip-Stacking a Reality in the FPGA Market Glenn O’Rourke Vice President of Manufacturing Technology & Product Quality October 2013 Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-01-22 10:41:36 Semiconductor device fabrication Fabless semiconductor companies Reconfigurable computing Xilinx Field-programmable gate array Through-silicon via Interposer Three-dimensional integrated circuit Integrated circuits Electronic engineering Electronics
33	Project result CT207 I D/TSV integration platform goes a long way in successfully meeting IC manufacturing challenges Add to Reading List Source URL: www.catrene.org Language: English - Date: 2014-09-16 09:43:41 Microtechnology Through-silicon via Wafer EV Group Three-dimensional integrated circuit Semiconductor device fabrication Electronics Electronic engineering
34	SILICON INTERPOSER TECHNOLOGIES FOR 3D SENSOR SYSTEMS Contact Add to Reading List Source URL: www.enas.fraunhofer.de Language: English - Date: 2015-01-16 06:06:47 Electromagnetism Technology Microtechnology Interposer Microelectromechanical systems Wafer Fraunhofer Society Through-silicon via Semiconductor device fabrication Integrated circuits Materials science
35	catalogue modules technos Add to Reading List Source URL: www-leti.cea.fr Language: English - Date: 2011-12-19 03:30:23 Through-silicon via Passivation Bumps race Semiconductor device fabrication Wafer 100 micrometres
36	Vac-High PC-Std. 15kV x600 (44mm) Add to Reading List Source URL: www.fab2asm.eu Language: English - Date: 2014-03-04 09:43:57 Electromagnetism Semiconductor device fabrication Semiconductor lasers Microtechnology Electrical engineering Vertical-cavity surface-emitting laser Microelectromechanical systems Laser Through-silicon via Optics Photonics Physics
37	Abstract Minapad 2012_version finale Add to Reading List Source URL: www-leti.cea.fr Language: English - Date: 2012-03-14 11:06:08 Through-silicon via Semiconductor device fabrication Integrated circuits Three-dimensional integrated circuit
38	Robust TSV ViaMiddle and ViaReveal Process Integration Accomplished through Characterization and Management of Sources of Variation Add to Reading List Source URL: www.appliedmaterials.com Language: English - Date: 2014-05-27 18:47:55 Microtechnology Chemical-mechanical planarization Etching Back end of line Copper interconnect Through-silicon via Wafer Chemical vapor deposition Three-dimensional integrated circuit Semiconductor device fabrication Electronics Technology
39	Endura® Ventura™ PVD First Metallization Solution for High-Volume Manufacturing of Through-Silicon Vias May 28, 2014 Add to Reading List Source URL: www.appliedmaterials.com Language: English - Date: 2014-05-28 07:48:48 Integrated circuits Technology Electronics manufacturing Three-dimensional integrated circuit Applied Materials Through-silicon via Flip chip Titanium nitride Via Electronics Electronic engineering Semiconductor device fabrication
40	Microsystem Integration and Packaging 3D Integration Technology RTI International is a leader in 3D integration technology, having developed a wide range of 3D process capabilities and achieved successful demonstrations Add to Reading List Source URL: www.rti.org Language: English - Date: 2013-03-19 09:35:14 Technology Three-dimensional integrated circuit Through-silicon via Wafer Integrated circuit RTI International Microfabrication Via EV Group Semiconductor device fabrication Electronic engineering Electronics